¼¼ÊõÁÁµã:
¸öÈËÏû·Ñµç×ÓºÍÎÞÏß²úÆ·ÒѾ³ÉΪµ±½ñÊÀ½çµç×ÓÊг¡µÄÖ÷µ¼Á¦Á¿¡£ÕâЩÉ豸¶ÔÓÚй¦ÄܺÍÌØÐÔµÄÎÞÖ¹¾³µÄÒªÇó´Ù½øÁË»ìºÏÐźÅÓ¦ÓÃÉ豸µÄÇ°ËùδÓеķ¢Õ¹¡£Ëæן´ÔÓÐÔÕý²»¶ÏÌá¸ß£¬¹¤³ÌʦÐèÒªÓ¦¶Ô½ôÆȵÄÉÏÊÐʱ¼äºÍ¶ÔÁ¼Æ·ÂÊÃô¸ÐµÄÄÉÃ×Éè¼Æ¡£ÆóÒµÒ²±ØÐëÔÚÓÐÏÞµÄÔ¤ËãºÍ¹¤³ÌʦÊýÁ¿Ï¿˷þËùÓÐÕâЩÕÏ°¡£ÊµÏÖÍŶÓÐèÒªÒ»ÖÖȫеķ½·¨£¬ÒÔ½â¾öÔڸ߹¤ÒÕ½ÚµãÏÂÓë¸ß²úÁ¿¡¢¸ßÐÔÄÜSoCÉè¼ÆÏà¹ØµÄ¸÷ÖÖÎÊÌâ¡£µ±½ñµÄ´óÐÍоƬͨ³£»¹»ìºÏÁËÄ£ÄâºÍÊý×ֵ緣¬Òª³ÉΪ¸ßЧÂʵÄÉè¼Æʦ£¬¾ÍÒªÓÐÔÚÏàͬ»·¾³Öнâ¾öÁ½ÖÖÉè¼ÆÈÎÎñÀàÐ͵ÄÄÜÁ¦¡£ CadenceµÄAMS»ìºÏÐźŵç·Éè¼Æ½â¾ö·½°¸ÎªÈ«Çò¹¤³ÌʦÌṩÁËAMSÉè¼ÆµÄ¼Ñƽ̨¡£
Cadence Encounter Êý×ÖICÉè¼Æƽ̨ÌṩÁËÄÉÃ×¼¶SoCÉè¼ÆËùÐèµÄÈ«·½Î»µÄ¼¼Êõ£¬°ïÖúÂß¼Éè¼ÆºÍÎïÀíʵÏÖÍŶӿìËÙÍê³É¸ßÖÊÁ¿µÄоƬ¡£ ¶øCadence Incisive ƽ̨ÌṩÁË¿ìÓÐЧµÄ·½Ê½¼ìÑé´óÐ͸´ÔÓоƬ¡£ËüÈ·±£ÄãµÄ²úÆ··ûºÏ¹æ·¶£¬Ïû³ýÁË¿ª·¢¹ý³ÌÖеÄÉú²úÁ¦¡¢¿ÉÔ¤²âÐÔºÍÖÊÁ¿·çÏÕ£¬´Ó¶øÄܹ»¼°Ê±ÍƳöûÓÐȱÏݵIJúÆ·¡£
Òªµã£º
1¡¢Semiconductor Market Overview (°ëµ¼ÌåÊг¡·¢Õ¹Ç÷ÊÆ)
2¡¢Cadence Technology Update (Cadenceм¼Êõ£©
3¡¢×¨ÌâÒ»£ºVerification/Digital IC Solutions£¨ÑéÖ¤¡¢Êý×ÖIC½â¾ö·½°¸£©
רÌâ¶þ£ºA/MS Design Solution £¨Ä£ÄâºÍ»ìºÏÐźÅÉè¼Æ½â¾ö·½°¸£©
רÌâÒ»Éæ¼°µÄ¼¼ÊõÄÚÈÝ£º
1. Verification update-- Felix Cha
2. Low Power Techniques Introduction
3. Cadence Low Power Solution overview
4. Common Power Format
5. Low Power Architecture Design with InCyte Chip Estimator (ICE)
6. Low Power Verification with Incisive Enterprise Simulation (IES)
7. Low Power Logic Synthesis with Encounter RTL Compiler (RC)
8. Low Power Physical Implementation with Encounter Design Implementation System (EDI)
9. Low Power Verification with Encounter Conformal Low Power (CLP)
10. Technical Discussion
רÌâ¶þÉæ¼°µÄ¼¼ÊõÄÚÈÝ:
1: Mixed-Signal Design overview
2: Cadence Mixed-Signal Design solution
3: Analog and Mixed-Signal design Environment
4: SPICE Simulation and Turbo Technology
5: Mixed-Signal Simulation Methodology
6: Full-Chip transistor level Verification
7: Fast Physical Layout implementation
8: Accuracy and powerful Physical Verification
9: Parasitic Extraction and Back-annotation technology
10:Technical Discussion
|
±ØÓ®nn699net¡¡
849322415
×ܲ¿ÀîÀÏʦ
